IEC 60191-6-22:2012
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
OVERVIEW
IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2012 |
| No. of Pages | 34 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47/SC 47D |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |