IEC 60249-2-13:1987
Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
OVERVIEW
Gives requirements for properties of flexible copper-clad polyimide film, general purpose grade including optional requirements which apply only by agreement between purchaser and supplier. The material consists of an insulating flexible film base with copper foil bonded to one or both sides, with or without the use of an adhesive.
COMMENTS
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PRODUCT DETAILS
| Status | |
|---|---|
| Edition | 1987 |
| No. of Pages | 23 |
| ICS Classification | 31.180 Printed circuits and boards |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |