IEC 60749-16:2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
OVERVIEW
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2003 |
| No. of Pages | 13 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |