IEC 61189-2:1997
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
OVERVIEW
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.
COMMENTS
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PRODUCT DETAILS
| Status | Revised |
|---|---|
| Edition | 1997 |
| No. of Pages | 139 |
| ICS Classification | 31.180 Printed circuits and boards |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |