IEC 60191-6-8:2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
OVERVIEW
IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2001 |
| No. of Pages | 22 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47/SC 47D |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |