IEC 60326-11:1991

Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections

OVERVIEW

Relates to flex-rigid multilayer printed boards with through connections irrespective of their method of manufacture. Intended as a basis on which agreements between purchaser and vendor can be made. Defines the characteristics to be assessed, the test methods to be used, and establishes uniform requirements for judging properties and dimensions. Not applicable to flat cables.

COMMENTS

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PRODUCT DETAILS

Status Withdrawn - 02 Jan 2026
Edition 1991
No. of Pages 59
ICS Classification 31.180 Printed circuits and boards
Committee TC 91
Available for Purchase For sale in Singapore only
Adoption IEC