IEC PAS 62191:2000
Acoustic microscopy for nonhermetic encapsulated electronic components
OVERVIEW
Defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. Provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compounds voids, etc.) nondestructively in plastic packages while achieving reproducibility.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2000 |
| No. of Pages | 16 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |