IEC TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
OVERVIEW
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2014 |
| No. of Pages | 187 |
| ICS Classification | 31.180 Printed circuits and boards |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |