IEC 60749-25:2003
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
OVERVIEW
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2003 |
| No. of Pages | 25 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |