FAQs
IEC 60749-19:2003/AMD1:2010
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear...
IEC 60749-16:2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise...
IEC 60749-14:2003
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of...
IEC 60749-11:2002
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of...
IEC 60749-10:2002
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-1:2002
Semiconductor devices - Mechanical and climatic test methods - Part 1: General
IEC 60747-1:2006
Semiconductor devices - Part 1: General
IEC 60747-1:2006/AMD1:2010
Amendment 1 - Semiconductor devices - Part 1: General
IEC 60539-2:2019
Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification...