FAQs
IEC 60749-27:2006/AMD1:2012
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27:...
IEC 60749-25:2003
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-24:2004
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture...
IEC 60749-23:2004
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature...
IEC 60749-23:2004/AMD1:2011
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High...
IEC 60749-22:2002
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60749-21:2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-2:2002
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
IEC 60749-19:2003
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength